Ultra-Dense: an MCM-based 3-D digital signal processor

Author

Segelken, John M. ; Wu, Les J. ; Lau, Maureen Y. ; Tai, King L. ; Shively, Richard R. ; Grau, Thomas G.

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

438

Lastpage

443

Abstract

The DSP3 Multiprocessor Project has produced a multi-GFLOP machine that is applicable to a variety of signal processing and pattern recognition problems. A companion program, the Ultra-Dense Project, is utilizing silicon-on-silicon multichip module (MCM) technology and innovative advanced packaging and physical design to achieve a parallel three-dimensional digital signal processor based on the DSP3. The authors present an overview and outline systems architecture the micro-interconnect technology (Si-on-Si MCM), and advances in physical design and packaging technology leading to an ultra-dense project demonstration

Keywords

multichip modules; packaging; parallel architectures; parallel machines; 3-D digital signal processor; DSP3; Multiprocessor Project; Si-Si modules; Si-on-Si MCM; Ultra-Dense Project; micro-interconnect technology; multi-GFLOP machine; overview; packaging technology; parallel processors; physical design; systems architecture; ultra-dense project demonstration; Application specific integrated circuits; Digital signal processing; Digital signal processors; Lattices; Packaging machines; Pattern recognition; Routing; Signal processing; Throughput; Topology;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159871

Filename

159871