DocumentCode :
841934
Title :
Study of Electrical Stress Effect on SiGe HBT Low-Noise Amplifier Performance by Simulation
Author :
Yu, Chuanzhao ; Yuan, J.S. ; Shen, John ; Xiao, Enjun
Author_Institution :
Sch. of Electr. & Comput. Eng., Central Florida Univ., Orlando, FL
Volume :
6
Issue :
4
fYear :
2006
Firstpage :
550
Lastpage :
555
Abstract :
This paper investigates the hot-carrier-induced performance degradation in a cascode low-noise amplifier using SiGe heterojunction bipolar transistors. Changes in device characteristics due to accelerated hot-carrier stress are examined experimentally. The vertical bipolar inter-company (VBIC) model parameters extracted from measured device data before and after stress are used in Cadence SpectreRF simulation to evaluate the circuit performance degradation
Keywords :
Ge-Si alloys; bipolar analogue integrated circuits; heterojunction bipolar transistors; hot carriers; low noise amplifiers; stress effects; Cadence SpectreRF simulation; SiGe; SiGe HBT low-noise amplifier; circuit performance degradation; electrical stress effect; vertical bipolar inter-company model parameters; Acceleration; Circuit simulation; Data mining; Degradation; Germanium silicon alloys; Heterojunction bipolar transistors; Hot carriers; Low-noise amplifiers; Silicon germanium; Stress measurement; HBT; S-parameters; SiGe; VBIC model; hot-carriers; low-noise amplifier;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2006.887464
Filename :
4019423
Link To Document :
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