Characterization and modeling of packages by a time-domain reflectometry approach

Author

Van Hauwermeiren, Luc ; Herreman, Mieke ; Botte, Marnix ; De Zutter, Daniël

Author_Institution

Lab. of Electromagn. & Acoust., Ghent Univ., Belgium

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

478

Lastpage

482

Abstract

An approach that offers the possibility of characterizing different types of packages is presented. The types that will be discussed are plastic leadless chip carrier (PLLCC), ceramic leadless chip carrier (CLLCC), pin grid array (PGA), and flat pack all of which have a high input-output (I/O) lead count. The characteristics of a signal pin (track inside the package) and the coupling between neighboring pins for different configurations is determined in the time domain by a time-domain reflectometry approach

Keywords

VLSI; crosstalk; packaging; time-domain reflectometry; CLCC; PGA; PLCC; QFP; ceramic leadless chip carrier; characterisation; configurations; coupling between neighboring pins; crosstalk; high lead count; high pin-out; modeling; pin grid array; plastic leadless chip carrier; quad flat pack; signal pin; time-domain reflectometry; track inside package; Bit rate; Ceramics; Electronics packaging; Impedance; Integrated circuit measurements; Integrated circuit packaging; Pins; Plastics; Reflectometry; Time domain analysis;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159876

Filename

159876