Title :
Characterization and modeling of packages by a time-domain reflectometry approach
Author :
Van Hauwermeiren, Luc ; Herreman, Mieke ; Botte, Marnix ; De Zutter, Daniël
Author_Institution :
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
fDate :
8/1/1992 12:00:00 AM
Abstract :
An approach that offers the possibility of characterizing different types of packages is presented. The types that will be discussed are plastic leadless chip carrier (PLLCC), ceramic leadless chip carrier (CLLCC), pin grid array (PGA), and flat pack all of which have a high input-output (I/O) lead count. The characteristics of a signal pin (track inside the package) and the coupling between neighboring pins for different configurations is determined in the time domain by a time-domain reflectometry approach
Keywords :
VLSI; crosstalk; packaging; time-domain reflectometry; CLCC; PGA; PLCC; QFP; ceramic leadless chip carrier; characterisation; configurations; coupling between neighboring pins; crosstalk; high lead count; high pin-out; modeling; pin grid array; plastic leadless chip carrier; quad flat pack; signal pin; time-domain reflectometry; track inside package; Bit rate; Ceramics; Electronics packaging; Impedance; Integrated circuit measurements; Integrated circuit packaging; Pins; Plastics; Reflectometry; Time domain analysis;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
