DocumentCode :
841962
Title :
Modification of `SPICE´ for simulation of coupled packaging interconnections
Author :
Lee, Dongjin ; Palusinski, O.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
15
Issue :
4
fYear :
1992
fDate :
8/1/1992 12:00:00 AM
Firstpage :
491
Lastpage :
496
Abstract :
A modification of SPICE program, version 2G.6, that allows simulation of networks with multiconductor, lossless transmission lines is dealt with. Terminating networks may contain nonlinear active devices defined in the SPICE format. All SPICE 2G.6 transient analysis features and transistor models are supported. The authors describe the computational procedure based on the transmission line equivalent circuit, explain the principle of SPICE implementation, and give examples of application. The simulator developed is also useful in determining the upper limit for crosstalk in systems with lossy lines. However, the simulator underestimates the transmission delays in such cases, and corrections might be needed. Such corrections are relatively easy to do in most practical cases, where DC losses are dominant
Keywords :
SPICE; coupled circuits; crosstalk; transient response; transmission line theory; LSPICE; SPICE 2G.6; SPICE program modification; computational procedure; coupled interconnections; lossy lines; multiple coupled transmission lines; nonlinear active devices; transient analysis features; transistor models; transmission delays; transmission line equivalent circuit; Circuit simulation; Computational modeling; Couplings; Distributed parameter circuits; Equivalent circuits; Multiconductor transmission lines; Packaging; Propagation losses; SPICE; Transient analysis;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.159878
Filename :
159878
Link To Document :
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