DocumentCode :
841970
Title :
Physical Model of Field Enhancement and Edge Effects of FinFET Charge-Trapping NAND Flash Devices
Author :
Hsu, Tzu-Hsuan ; Lue, Hang-Ting ; King, Ya-Chin ; Hsiao, Yi-Hsuan ; Lai, Sheng-Chih ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Emerging Central Lab. (ECL), Macronix Int. Co., Ltd. (MXIC), Hsinchu
Volume :
56
Issue :
6
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
1235
Lastpage :
1242
Abstract :
The physical model for field enhancement (FE) and the edge effects of body-tied FinFET charge-trapping NAND Flash devices are extensively studied in this paper. First, analytical equations are derived to provide insight to the FE effect for FinFET devices, and these analytical results are validated by 3-D TCAD simulation and experimental verification. Next, complicated programming and erasing characteristics and transconductance and subthreshold slope (gm/SS) behaviors are completely explained by the nonuniform injection behavior along various corner edges in FinFET. FE allows high program and erase speed and larger memory window. On the other hand, the edge effect complicates the device DC I-V, as well as programming and erasing characteristics, and these must be taken into account in memory circuit design.
Keywords :
MOSFET; NAND circuits; flash memories; technology CAD (electronics); 3-D TCAD simulation; FinFET charge-trapping NAND flash devices; edge effects; field enhancement effects; memory circuit design; subthreshold slope; transconductance; Analytical models; Circuit synthesis; Equations; FinFETs; Flash memory; Iron; Laboratories; Nonvolatile memory; SONOS devices; Transconductance; Bandgap-engineered SONOS (BE-SONOS) NAND; body-tied FinFET; edge effect; field enhancement (FE); geometrical effect;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2018713
Filename :
4912416
Link To Document :
بازگشت