A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling

Author

Huang, Jihua ; Lai, H.Y. ; Qian, Y.Y. ; Jiang, Y.H. ; Wang, Q.L.

Author_Institution

Univ. of Sci. & Technol., Beijing, China

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

553

Lastpage

558

Abstract

A damage model of low cycle shear fatigue has been developed in dislocation theory. On the basis of this model, a formula including the factors of thermal cycle temperature, dwell time, and atmospheric oxidation has been established to predict the life of surface mount technology (SMT) solder joints under thermal cycling. This formula has been verified by experiments on the specimens of actual SMT assemblies. The results show that the life formula established coincides with the experimental results

Keywords

design engineering; environmental testing; fatigue testing; life testing; reliability; soldering; surface mount technology; SMT assemblies; SMT solder joints; atmospheric oxidation; damage model; dislocation model; dislocation theory; dwell time; experimental results; experiments; fatigue life temperature range; life prediction; low cycle shear fatigue; shear fatigue damage; surface mount technology; thermal cycling; Atmospheric modeling; Creep; Equations; Fatigue; Oxidation; Predictive models; Soldering; Surface-mount technology; Temperature; Thermal factors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159885

Filename

159885