Title :
A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling
Author :
Huang, Jihua ; Lai, H.Y. ; Qian, Y.Y. ; Jiang, Y.H. ; Wang, Q.L.
Author_Institution :
Univ. of Sci. & Technol., Beijing, China
fDate :
8/1/1992 12:00:00 AM
Abstract :
A damage model of low cycle shear fatigue has been developed in dislocation theory. On the basis of this model, a formula including the factors of thermal cycle temperature, dwell time, and atmospheric oxidation has been established to predict the life of surface mount technology (SMT) solder joints under thermal cycling. This formula has been verified by experiments on the specimens of actual SMT assemblies. The results show that the life formula established coincides with the experimental results
Keywords :
design engineering; environmental testing; fatigue testing; life testing; reliability; soldering; surface mount technology; SMT assemblies; SMT solder joints; atmospheric oxidation; damage model; dislocation model; dislocation theory; dwell time; experimental results; experiments; fatigue life temperature range; life prediction; low cycle shear fatigue; shear fatigue damage; surface mount technology; thermal cycling; Atmospheric modeling; Creep; Equations; Fatigue; Oxidation; Predictive models; Soldering; Surface-mount technology; Temperature; Thermal factors;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
