3D measurement of thermal deformations on an ultra-high density circuit moduled with a laser range probe

Author

Gloeckner, Paul J. ; Kokini, Klod ; Stevenson, Warren H.

Author_Institution

Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

571

Lastpage

577

Abstract

A laser triangulation range sensor mounted on a coordinate measuring machine was used to measure thermally induced deformations in a circuit module. The module was housed in an environmental test chamber with optical access for the laser probe, and measurements were made over a 25-125°C range with an estimated accuracy of ±5 μm. The results clearly show relative 3D displacements of circuit module components which could cause failure of the module under thermal stress

Keywords

displacement measurement; measurement by laser beam; printed circuit testing; thermal stresses; 25 to 125 C; 3D displacements; 3D measurement; circuit module; coordinate measuring machine; environmental test chamber; laser range probe; laser triangulation range sensor; optical access; thermal deformations; thermal stress; thermally induced deformations; ultra-high density circuit; Assembly; Circuit testing; Coordinate measuring machines; Density measurement; Electronic packaging thermal management; Lead; Probes; Soldering; Temperature; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159887

Filename

159887