Title :
3D measurement of thermal deformations on an ultra-high density circuit moduled with a laser range probe
Author :
Gloeckner, Paul J. ; Kokini, Klod ; Stevenson, Warren H.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
fDate :
8/1/1992 12:00:00 AM
Abstract :
A laser triangulation range sensor mounted on a coordinate measuring machine was used to measure thermally induced deformations in a circuit module. The module was housed in an environmental test chamber with optical access for the laser probe, and measurements were made over a 25-125°C range with an estimated accuracy of ±5 μm. The results clearly show relative 3D displacements of circuit module components which could cause failure of the module under thermal stress
Keywords :
displacement measurement; measurement by laser beam; printed circuit testing; thermal stresses; 25 to 125 C; 3D displacements; 3D measurement; circuit module; coordinate measuring machine; environmental test chamber; laser range probe; laser triangulation range sensor; optical access; thermal deformations; thermal stress; thermally induced deformations; ultra-high density circuit; Assembly; Circuit testing; Coordinate measuring machines; Density measurement; Electronic packaging thermal management; Lead; Probes; Soldering; Temperature; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
