DocumentCode :
842076
Title :
Investigation of conduction mechanism in thick film resistors trimmed by the pulse voltage method
Author :
Tobita, Toshio ; Takasago, Hayato ; Kariya, Komyo
Author_Institution :
Mitsubishi Electric Corp., Hyogo, Japan
Volume :
15
Issue :
4
fYear :
1992
fDate :
8/1/1992 12:00:00 AM
Firstpage :
583
Lastpage :
589
Abstract :
The conduction mechanism of RuO2-based thick-film resistor (TFR) trimmed by the pulse voltage trimming (PVT) method is discussed. The surface temperature distribution barely changed when power was applied to the TFR, moreover, no current crowding was found by results of scanning electron microscopy-voltage contrast (SEM-VC). The existence of electron traps in the TFR could not be detected from the results of temperature stimulus current (TSC) characteristics. The resistance value of the TFR increased at 600°C and then decreased abruptly at 800°C. It was supposed, therefore, that the heat stress accumulated in the TFR during the refiring process of the TFRs was relaxed by the thermal annealing due to the PVT. Consequently, the decrease in the resistivity of the TFR, after the PVT, was quite logical, if an increase in the number of conductive paths resulted when the conductive structure was modified in the TFR. In addition, frequency resistance characteristics of the TFRs qualitatively best fit the values predicted by the metal-insulator-metal model
Keywords :
ruthenium compounds; thick film resistors; 600 C; 800 C; PVT; RuO2 thick films; conduction mechanism; frequency resistance characteristics; metal-insulator-metal model; pulse voltage trimming; refiring process; resistance trimming; surface temperature distribution; temperature stimulus current; thermal annealing; thick film resistors; Annealing; Electron traps; Proximity effect; Resistors; Scanning electron microscopy; Surface resistance; Temperature distribution; Thermal stresses; Thick films; Voltage;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.159889
Filename :
159889
Link To Document :
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