• DocumentCode
    843047
  • Title

    The introduction of Titanium into internal-Tin Nb3Sn by a variety of procedures

  • Author

    Gregory, E. ; Tomsic, M. ; Sumption, M.D. ; Peng, X. ; Wu, X. ; Collings, E.W. ; Zeitlin, B.A.

  • Author_Institution
    Supergenics ILLC, Jefferson, MA, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    3478
  • Lastpage
    3481
  • Abstract
    The advantages of titanium as a third element in Nb3Sn have been known for many years. It increases the upper critical field and lowers the critical current density at lower fields, thus reducing the losses, which are usually measured in this field region. Several methods for the introduction of titanium are listed and discussed briefly. The two methods discussed in more detail are both introduction by way of Nb47wt.%Ti. One is by wrapping foils around the filaments and the other by introducing rods into the filament array. A relatively uniform distribution of Ti in the filaments, results from both methods. Scanning Electron Microscopy (SEM) was used to illustrate the various phases, produced under different heat treatment conditions. Energy Dispersive Spectroscopy, (EDS) and Wavelength Dispersive Spectroscopy, (WDS) were both used to obtain compositional data.
  • Keywords
    critical current density (superconductivity); multifilamentary superconductors; niobium alloys; scanning electron microscopy; tin alloys; titanium alloys; Nb3Sn; NbTi; critical current density; energy dispersive spectroscopy; filament array; heat treatment; internal tin; scanning electron microscopy; superconductors; titanium; upper critical field; wavelength dispersive spectroscopy; Critical current density; Current measurement; Density measurement; Dispersion; Loss measurement; Niobium; Scanning electron microscopy; Spectroscopy; Tin; Titanium; Internal-tin; niobium; superconductors; tin; titanium;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2005.849067
  • Filename
    1440421