• DocumentCode
    843191
  • Title

    Effect of Oxygen Pressure on the Electrical Properties of \\hbox {Bi}_{5} \\hbox {Nb}_{3}\\hbox {O}_{15} Films Grown by RF Magnetron Sputtering

  • Author

    Cho, Kyung-Hoon ; Choi, Chang-Hak ; Choi, Joo-Young ; Seong, Tae-Geun ; Nahm, Sahn ; Kang, Chong-Yun ; Yoon, Seok-Jin ; Kim, Jong-Hee

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Korea Univ., Seoul
  • Volume
    29
  • Issue
    9
  • fYear
    2008
  • Firstpage
    984
  • Lastpage
    987
  • Abstract
    Bi5Nb3O15 (B5N3) films grown under a low oxygen partial pressure (OP) of 1.7 mtorr showed a high leakage current density of 0.1 A/cm2 at 1.0 MV/cm. However, the leakage current density decreased with increasing OP to a minimum of 5.8 times 10-9 A/cm2 for the film grown under 5.1 mtorr due to the decreased number of oxygen vacancies. This film also showed an improved breakdown field of 2.2 MV/cm and a large capacitance density of 24.9 fF /mum2. The electrical properties of the film, however, deteriorated with a further increase in OP, which is probably due to the formation of oxygen interstitial ions. Therefore, superior electrical properties for the B5N3 film can be obtained by careful control of OP.
  • Keywords
    bismuth compounds; capacitance; current density; dielectric thin films; electric breakdown; interstitials; leakage currents; sputter deposition; sputtered coatings; vacancies (crystal); Bi5Nb3O15; RF magnetron sputtering; electrical properties; leakage current density; low oxygen partial pressure; oxygen interstitial ions; Capacitance; High K dielectric materials; High-K gate dielectrics; Leakage current; MIM capacitors; Magnetic properties; Oxygen; Radio frequency; Sputtering; Temperature; $hbox{Bi}_{5}hbox{Nb}_{3}hbox{O}_{15} (hbox{B}_{5} hbox{N}_{3})$; high dielectric constant; leakage current density; metal–insulator–metal (MIM) capacitor; temperature coefficient of capacitance (TCC); voltage coefficient of capacitance (VCC);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2001476
  • Filename
    4604836