Title :
12-kV p-Channel IGBTs With Low On-Resistance in 4H-SiC
Author :
Zhang, Qingchun ; Das, Mrinal ; Sumakeris, Joe ; Callanan, Robert ; Agarwal, Anant
Author_Institution :
Cree Inc., Research Triangle Park, NC
Abstract :
SiC bipolar devices are favored over SiC unipolar devices for applications requiring breakdown voltage in excess of 10 kV. We have designed and fabricated p-channel insulated-gate bipolar transistors (IGBTs) in 4H-SiC with 12-kV blocking voltage for high-power applications. A differential on-resistance of 18.6 mOmega ldr cm2 was achieved with a gate bias of 16 V, corresponding to a forward voltage drop of 5.3 V at 100 A/cm2, indicating strong conductivity modulation in the p-type drift region. A moderately doped current enhancement layer grown on the lightly doped drift layer effectively reduces the JFET resistance while maintaining a high carrier lifetime for conductivity modulation. The p-channel IGBT (p-IGBT) exhibits a transconductance that is 3times higher than that of the 12-kV n-channel SiC IGBTs. An inductive switching test was done at 1.5 kV and 0.55 A (~440 A/cm2) for the p-IGBTs, and a turn-on time of 40 ns and a turn-off time of ~2.8 mus were measured.
Keywords :
insulated gate bipolar transistors; power bipolar transistors; semiconductor device models; semiconductor device testing; semiconductor doping; silicon compounds; H-SiC; bipolar devices; breakdown voltage; conductivity modulation; current 0.55 A; differential on-resistance; inductive switching test; insulated-gate bipolar transistor; lightly doped drift layer; moderately doped current enhancement layer; p-channel IGBT; p-type drift region; transconductance; voltage 1.5 kV; voltage 12 kV; voltage 16 V; voltage 5.3 V; Conductivity; Doping; Insulated gate bipolar transistors; Insulation; MOSFETs; Nitrogen; Plasma temperature; Silicon carbide; Transconductance; Voltage; High voltage; insulated-gate bipolar transistors (IGBTs); on-resistance; power devices; silicon carbide; transconductance;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2008.2001739