• DocumentCode
    843450
  • Title

    Heat and Fluid Flow in an Optical Switch Bubble

  • Author

    Uebbing, John J. ; Hengstler, Stephan ; Schroeder, Dale ; Venkatesh, Shalini ; Haven, Rick

  • Author_Institution
    Spudnik, Inc, San Jose, CA
  • Volume
    15
  • Issue
    6
  • fYear
    2006
  • Firstpage
    1528
  • Lastpage
    1539
  • Abstract
    The Agilent all-optical bubble switch uses bubbles in an organic fluid index matched to a silica planar lightwave circuit. The bubble is created and sustained by heaters that are deposited on an attached silicon substrate. Testing of the bubble shows how heater power and ambient pressure affect bubble shape, size, and optical reflection characteristics. Heat and fluid flow in the bubble were modeled in 2D and 3D using the homogeneous bubble model in the Flow3D modeling software. Fluid condensing on the trench wall causes a dimple on the bubble and hence nonoptimum optical reflection. To aid understanding, the bubble, silica walls, and heaters were also modeled as a thermal resistance network. Because the pressure drop across the bubble wall is fixed, the bubble size is determined by Pres/DeltaTt , where Pres is the heater power and DeltaTt is the temperature difference between the bubble and the substrate. Heating the trench walls beyond the bubble temperature with heaters located underneath the trench wall will dry out the trench wall and give a stable optical reflection. As DeltaTt approaches zero, a bubble is sustained without any heater power and with zero fluid flow. This "static" bubble provides for a very stable optical reflection
  • Keywords
    bubbles; finite difference methods; heat transfer; light reflection; microactuators; optical switches; thermal resistance; Agilent; bubble temperature; flow3D modeling software; fluid flow; heat flow; homogeneous bubble; microactuators; microelectromechanical devices; microfluidics; nonoptimum optical reflection; optical switch bubble; organic fluid index; resistance heating; silica planar light wave circuit; silicon substrate; thermal resistance network; Circuit testing; Fluid flow; Optical reflection; Optical switches; Resistance heating; Shape; Silicon compounds; Switching circuits; Temperature; Thermal resistance; Bubbles; fluidics; microactuators; microelectromechanical devices; optical switches; resistance heating;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2006.883529
  • Filename
    4020296