Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
Several aspects of the multichip module technology, including its functions, leverages, applications, and markets, are reviewed. All the packaging technologies used in multichip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed. The module corrections and electrical testing used in forming a high-performance or portable system are also discussed
Keywords :
encapsulation; hybrid integrated circuits; integrated circuit technology; multichip modules; reviews; seals (stoppers); MCM packaging; ceramic; chip level connections; electrical testing; encapsulation; heat removal; multichip module technology; printed wiring; sealing; thin film; Aerospace electronics; Aerospace industry; Automotive engineering; Consumer electronics; Electronics packaging; Encapsulation; Semiconductor device packaging; Space technology; Substrates; Tutorial;
