DocumentCode :
843546
Title :
Special issue on Compact Interconnect Models for Giga Scale Integration
Volume :
29
Issue :
9
fYear :
2008
Firstpage :
1082
Lastpage :
1082
Abstract :
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.2004842
Filename :
4604869
Link To Document :
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