DocumentCode
843649
Title
Hybrid microelectronics: Old hat for new times?
Author
Elshabini-Riad, Aicha ; Stephenson, F.W.
Volume
6
Issue
2
fYear
1990
fDate
3/1/1990 12:00:00 AM
Firstpage
42
Lastpage
47
Abstract
The proliferation of hybrid techniques, which are adapting to new demands in automotive electronics, household appliances, packaging structures for the VHSIC program, and many other applications, is examined. Thick- and thin-film materials, design, and processing are described and compared. The use of multilayer ceramic systems and advances in power hybrids and hybrid microwave integrated circuits are discussed.<>
Keywords
hybrid integrated circuits; microwave integrated circuits; power integrated circuits; thick film circuits; thin film circuits; VHSIC; automotive electronics; household appliances; hybrid microwave integrated circuits; hybrid techniques; multilayer ceramic systems; packaging structures; power hybrids; thick-films materials; thin-film materials; Automotive electronics; Ceramics; Electronics packaging; Home appliances; Integrated circuit packaging; Microelectronics; Nonhomogeneous media; Process design; Thin film circuits; Very high speed integrated circuits;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.46057
Filename
46057
Link To Document