Title :
Hybrid microelectronics: Old hat for new times?
Author :
Elshabini-Riad, Aicha ; Stephenson, F.W.
fDate :
3/1/1990 12:00:00 AM
Abstract :
The proliferation of hybrid techniques, which are adapting to new demands in automotive electronics, household appliances, packaging structures for the VHSIC program, and many other applications, is examined. Thick- and thin-film materials, design, and processing are described and compared. The use of multilayer ceramic systems and advances in power hybrids and hybrid microwave integrated circuits are discussed.<>
Keywords :
hybrid integrated circuits; microwave integrated circuits; power integrated circuits; thick film circuits; thin film circuits; VHSIC; automotive electronics; household appliances; hybrid microwave integrated circuits; hybrid techniques; multilayer ceramic systems; packaging structures; power hybrids; thick-films materials; thin-film materials; Automotive electronics; Ceramics; Electronics packaging; Home appliances; Integrated circuit packaging; Microelectronics; Nonhomogeneous media; Process design; Thin film circuits; Very high speed integrated circuits;
Journal_Title :
Circuits and Devices Magazine, IEEE
