Title :
Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression
Author :
Xia, Lei ; Meng, Jicheng ; Xu, Ruimin ; Yan, Bo ; Guo, Yunchuan
Author_Institution :
Dept. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
Abstract :
In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set of training data and testing data, which is produced by the electromagnetic simulation. Experimental results suggest that the developed model performs with a good predictive ability in analyzing the electrical performance
Keywords :
ceramic packaging; integrated circuit interconnections; integrated circuit packaging; regression analysis; support vector machines; 3D high density microwave packaging structure; 3D vertical interconnect; electromagnetic simulation; fuzz button; low temperature co-fired ceramic; support vector machine regression; support vector regression; Artificial neural networks; Dielectric substrates; Electromagnetic modeling; Integrated circuit interconnections; Predictive models; Risk management; Support vector machine classification; Support vector machines; Testing; Training data; Fuzz button; low temperature co-fired ceramic (LTCC); support vector machine (SVM); support vector regression (SVR); three-dimensional (3-D) vertical interconnect;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2006.885585
