Title :
Co-Sputtered Amorphous Nb
Si
Barriers for Josephson-Junction Circuits
Author :
Baek, Burm ; Dresselhaus, Paul D. ; Benz, Samuel P.
Author_Institution :
Nat. Inst. of Stand. & Technol., Boulder, CO
Abstract :
Co-sputtered amorphous NbxSi1-x has been developed as a barrier material for Josephson-junction array circuits. This material is quite promising as a normal-metal barrier for state-of-the-art Josephson voltage standards. In addition, the capability of tuning the barrier resistivity over a wide range that includes the metal-insulator transition could lead to applications in high-speed superconductive electronics. The electrical characteristics and uniformity of amorphous NbxSi1-x-barrier junctions are similar to those of other normal-metal barriers, but the superior etching properties makes this barrier material especially promising for tall, stacked junctions that are required for high-junction-density applications. Under appropriate deposition conditions, the reproducibility of devices with co-sputtered amorphous NbxSi1-x is sufficient to produce high-quality stacked-junction superconductive devices
Keywords :
amorphous state; etching; metal-insulator transition; niobium alloys; silicon alloys; superconducting arrays; superconducting junction devices; superconducting thin films; superconductivity; Josephson-junction array circuits; NbxSi1-x; amorphous barrier junctions; barrier material; barrier resistivity; cosputtered amorphous barriers; electrical characteristics; etching properties; high-junction-density applications; high-quality stacked-junction superconductive devices; high-speed superconductive electronics; metal-insulator transition; normal-metal barrier; state-of-the-art Josephson voltage standards; superconducting thin films; tuning; Amorphous materials; Circuit optimization; Conductivity; Electric variables; Etching; Metal-insulator structures; Niobium; Superconducting materials; Superconductivity; Voltage; Amorphous alloy; Josephson arrays; metal-insulator transition; superconducting devices; thin-film devices;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2006.881816