• DocumentCode
    844454
  • Title

    Compensation of packaging asymmetry in a 2-D wind sensor

  • Author

    Matova, S.P. ; Makinwa, Kofi A A ; Huijsing, Johan H.

  • Author_Institution
    Fac. of Inf. Technol. & Syst., Delft Univ. of Technol., Netherlands
  • Volume
    3
  • Issue
    6
  • fYear
    2003
  • Firstpage
    761
  • Lastpage
    765
  • Abstract
    The influence of packaging on the behavior of a two-dimensional thermal wind sensor has been investigated. Non-ideal packaging increases the thermal asymmetry in the sensor, which in turn distorts its output signal. Such distortion can be compensated for by adjusting the heat distribution in the sensor. Using a combination of CAD modeling techniques, expressions have been derived from which the compensating heat distribution may be directly computed from the uncompensated sensor output.
  • Keywords
    anemometers; atmospheric techniques; flow measurement; packaging; thermopiles; wind; 2D wind sensor; CAD modeling; compensation; electrothermal analogy; heat distribution adjustment; nonideal packaging; output signal distorsion; packaging asymmetry; thermal asymmetry; thermal wind sensor; Ceramics; Distortion; Electronic packaging thermal management; Resistors; Semiconductor device measurement; Silicon; Temperature measurement; Temperature sensors; Thermal sensors; Two dimensional displays;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2003.820324
  • Filename
    1254552