Title :
Compensation of packaging asymmetry in a 2-D wind sensor
Author :
Matova, S.P. ; Makinwa, Kofi A A ; Huijsing, Johan H.
Author_Institution :
Fac. of Inf. Technol. & Syst., Delft Univ. of Technol., Netherlands
Abstract :
The influence of packaging on the behavior of a two-dimensional thermal wind sensor has been investigated. Non-ideal packaging increases the thermal asymmetry in the sensor, which in turn distorts its output signal. Such distortion can be compensated for by adjusting the heat distribution in the sensor. Using a combination of CAD modeling techniques, expressions have been derived from which the compensating heat distribution may be directly computed from the uncompensated sensor output.
Keywords :
anemometers; atmospheric techniques; flow measurement; packaging; thermopiles; wind; 2D wind sensor; CAD modeling; compensation; electrothermal analogy; heat distribution adjustment; nonideal packaging; output signal distorsion; packaging asymmetry; thermal asymmetry; thermal wind sensor; Ceramics; Distortion; Electronic packaging thermal management; Resistors; Semiconductor device measurement; Silicon; Temperature measurement; Temperature sensors; Thermal sensors; Two dimensional displays;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2003.820324
