DocumentCode :
844598
Title :
Strained ultrahigh performance fully depleted nMOSFETs with ft of 330 GHz and sub-30-nm gate lengths
Author :
Singh, D.V. ; Jenkins, K.A. ; Sleight, J. ; Ren, Z. ; Ieong, M. ; Haensch, W.
Author_Institution :
IBM T. J. Watson Res. Center, IBM Semicond. R&D Center, Yorktown Heights, NY, USA
Volume :
27
Issue :
3
fYear :
2006
fDate :
3/1/2006 12:00:00 AM
Firstpage :
191
Lastpage :
193
Abstract :
Ultrahigh performance fully depleted nMOSFETs have been fabricated on ultra-thin silicon-on-insulator (UTSOI) with a body thickness of 18 nm and channel lengths down to 20 nm. Uniaxial tensile stress induced in the channel using stressed contact liners and stress memorization was found to significantly improve ac performance, resulting in cutoff frequencies ft as high as 330 GHz. This is the highest fT value reported on fully depleted UTSOI MOSFETs and is among the highest fT values for any Si-based field-effect transistor. Stress memorization and stressed contact liners were found to have little impact on gate to source capacitance indicating that the enhancement in fT results primarily from stress-induced enhancements in transconductance.
Keywords :
MOSFET; internal stresses; nanoelectronics; silicon-on-insulator; 18 nm; 20 nm; 330 GHz; Si; UTSOI MOSFET; fully depleted field-effect transistor; gate-source capacitance; nMOSFET; strained ultrahigh performance field-effect transistor; stress memorization; stressed contact liners; transconductance; ultra-thin silicon-on-insulator; uniaxial tensile stress; Cutoff frequency; Electron mobility; FETs; Implants; MOSFETs; Parasitic capacitance; Research and development; Silicon on insulator technology; Tensile stress; Transconductance; Fully depleted (FD); MOSFET; high frequency; silicon-on-insulator (SOI); stress liner; stress memorization; ultrathin body;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2006.870254
Filename :
1599476
Link To Document :
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