Title :
Effect of the inlet location on the performance of parallel-channel cold-plate
Author :
Ming-Chang Lu ; Chi-Chuan Wang
Author_Institution :
Energy & Resources Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
fDate :
3/1/2006 12:00:00 AM
Abstract :
This study numerically examines the influence of inlet locations on the performance of the Multichannel cold-plates. A total of five inlet configurations (namely I-, Z-, ]-, L-, and /spl Gamma/-arrangement) are investigated in this study. The velocity maldistribution and nonuniformity of temperature field caused by the fluid flow are shown in the simulation. For I-arrangement, higher inlet flow rate of the cold-plate shows more considerable maldistribution, and this maldistribution is decreased when the number of channels of the cold-plate is increased. The Z-arrangement and L-arrangements show a pronounced flow-recirculation that eventually leads to a much larger temperature difference along the surface of the cold-plate. Conversely, there is no flow recirculation in the ]-arrangement and a comparatively uniform flow distribution is seen. For the same average inlet velocity, I-arrangement has the highest pressure drop whereas ]-arrangement shows the lowest pressure drop. The I- and /spl Gamma/-arrangement give the best heat transfer performance due to their impingement configurations whereas the Z-arrangement shows the lowest heat transfer performance for its dramatic flow recirculation and maldistribution.
Keywords :
cooling; flow simulation; temperature distribution; thermal management (packaging); flow-recirculation; fluid flow; heat transfer performance; inlet configurations; inlet flow rate; inlet location effect; inlet velocity; multichannel cold-plates; parallel-channel cold-plates; pressure drop; temperature field; uniform flow distribution; velocity maldistribution; Acceleration; Conductivity; Electronic equipment testing; Electronics cooling; Fluid flow; Heat transfer; Hydraulic diameter; Liquid cooling; Maldistribution; Temperature distribution; Cold-plate; heat transfer; maldistribution; parallel channel;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.850539