Title :
Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology
Author :
Yingjun Cheng ; Gaowei Xu ; Dapeng Zhu ; Wenjie Zhu ; Luo, Lei
Author_Institution :
Shanghai Inst. of Microsystems & Inf. Technol., Chinese Acad. of Sci., Shanghai, China
fDate :
3/1/2006 12:00:00 AM
Abstract :
This paper demonstrates the application of computational fluid dynamic (CFD) simulation and response surface methodology (RSM) in analyzing the thermal performance of a high input/outputs, seven chips, indirect liquid cooled multichip module which will be applied in a kind of supercomputer. A series of similar experiments and corresponding CFD simulations are conducted firstly to evaluate the validity of CFD simulation method and determine the interfacial thermal resistance of thermal grease iteratively, and then a three-dimensional CFD model is established to investigate the heat transfer and fluid flow of the multichip module. Based on the CFD model, the individual effects of factors such as thermal conductivity of the thermal interface material and thermal grease, thickness of the chips, space between chips, solder bump patterns, solder ball patterns, flow velocity and liquid inlet temperature on the thermal performance of the module are studied with one-factor-at-a-time experimentation, and after that, four significant factors are selected to establish a response surface model of the maximum temperature of the module with central composite design based RSM and analysis of variance.
Keywords :
computational fluid dynamics; cooling; flow simulation; multichip modules; response surface methodology; thermal analysis; thermal management (packaging); thermal resistance; computational fluid dynamic simulation; flow velocity; fluid flow; heat transfer; indirect liquid cooling; interfacial thermal resistance; liquid inlet temperature; multichip module; response surface methodology; solder ball patterns; solder bump patterns; supercomputer; thermal analysis; thermal grease; thermal performance; Analytical models; Computational fluid dynamics; Computational modeling; Fluid flow; Multichip modules; Response surface methodology; Temperature; Thermal conductivity; Thermal factors; Thermal resistance; Computational fluid dynamic (CFD); indirect liquid cooling; multichip module; response surface methodology (RSM);
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.848589