Title :
Applying material optimization to fracture mechanics analysis to improve the reliability of the plastic IC package in reflow soldering process
Author :
Geun Woo Kim ; Kang Yong Lee
Author_Institution :
Sch. of Mech. Eng., Yonsei Univ., Seoul, South Korea
fDate :
3/1/2006 12:00:00 AM
Abstract :
To prevent crack propagation in a plastic small outline J-lead package with a dimpled diepad under an IR soldering process, parametric study and optimization with respect to material properties are done. The main design variables among all material properties are determined from the parametric study. Their optimized values are determined by applying a constraint optimization technique to the IC package.
Keywords :
fracture mechanics; integrated circuit packaging; integrated circuit reliability; optimisation; plastic packaging; reflow soldering; IR soldering process; constraint optimization technique; crack propagation; fracture mechanics analysis; integrated circuit reliability; material optimization; plastic IC package reliability; plastic J-lead package; reflow soldering process; thermal loading; Electromagnetic compatibility; Integrated circuit packaging; Material properties; Materials reliability; Moisture; Parametric study; Plastic integrated circuit packaging; Reflow soldering; Temperature; Thermal stresses; Constraint optimization; parametric study; plastic IC package; thermal loading;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.850512
