Applying material optimization to fracture mechanics analysis to improve the reliability of the plastic IC package in reflow soldering process

Author

Geun Woo Kim ; Kang Yong Lee

Author_Institution

Sch. of Mech. Eng., Yonsei Univ., Seoul, South Korea

Volume

29

Issue

1

fYear

2006

fDate

3/1/2006 12:00:00 AM

Firstpage

47

Lastpage

53

Abstract

To prevent crack propagation in a plastic small outline J-lead package with a dimpled diepad under an IR soldering process, parametric study and optimization with respect to material properties are done. The main design variables among all material properties are determined from the parametric study. Their optimized values are determined by applying a constraint optimization technique to the IC package.

Keywords

fracture mechanics; integrated circuit packaging; integrated circuit reliability; optimisation; plastic packaging; reflow soldering; IR soldering process; constraint optimization technique; crack propagation; fracture mechanics analysis; integrated circuit reliability; material optimization; plastic IC package reliability; plastic J-lead package; reflow soldering process; thermal loading; Electromagnetic compatibility; Integrated circuit packaging; Material properties; Materials reliability; Moisture; Parametric study; Plastic integrated circuit packaging; Reflow soldering; Temperature; Thermal stresses; Constraint optimization; parametric study; plastic IC package; thermal loading;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2005.850512

Filename

1599492