• DocumentCode
    844999
  • Title

    Fully silicided NiSi and germanided NiGe dual gates on SiO2 n- and p-MOSFETs

  • Author

    Yu, D.S. ; Wu, C.H. ; Huang, C.H. ; Chin, Albert ; Chen, W.J. ; Zhu, Chunxiang ; Li, M.F. ; Kwong, Dim-Lee

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    24
  • Issue
    12
  • fYear
    2003
  • Firstpage
    739
  • Lastpage
    741
  • Abstract
    We have fabricated the fully silicided NiSi and germanided NiGe dual gates n- and p-MOSFETs on 1.9 nm thick SiO/sub 2/ gate dielectric. The extracted work functions of fully NiSi and NiGe gates from thickness-dependent flat band voltage were 4.55 and 5.2 eV respectively, which may provide possible wide work function tuning using NiSi/sub t-x/Ge/sub x/. In additional to the lower gate current than Al gate n- and p-MOSFETs, the fully silicided NiSi and germanided NiGe gates MOSFETs show electron and hole mobilities close to universal mobility values with special advantage of process compatible to current VLSI fabrication line.
  • Keywords
    MOSFET; electron mobility; hole mobility; leakage currents; nickel compounds; rapid thermal annealing; work function; NiGe; NiSi; SiO/sub 2/; VLSI process compatible; electron mobilities; fully germanided dual gates; fully silicided dual gates; hole mobilities; leakage current; lower gate current; nMOSFET; pMOSFET; thickness-dependent flat band voltage; universal mobility values; work functions; Charge carrier processes; Dielectric substrates; Electron mobility; Fabrication; Leakage current; MOSFET circuits; Silicidation; Temperature; Very large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2003.819274
  • Filename
    1254603