Title :
A recursive un-termination method for nondestructive in situ S-parameter measurement of hermetically encapsulated packages
Author :
Pfeiffer, Ullrich R. ; Schuster, Christian
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
6/1/2005 12:00:00 AM
Abstract :
In this paper, we analyze the performance of a newly introduced recursive un-termination method for nondestructive in situ S-parameter measurements of multiport packages. The fundamental limitations of the method are statistically analyzed and compared to conventional two-port probing techniques. The methodology is based on programmable terminations fully integrated in a standard silicon process technology (integrated-circuit chip) and a recursive un-terminating method implemented in software. To demonstrate the validity of the technique, results for a chip-on-board packaging technology have been compared to high-frequency electromagnetic simulations and direct two-port probing techniques.
Keywords :
S-parameters; chip-on-board packaging; flip-chip devices; integrated circuit packaging; lead bonding; nondestructive testing; recursive estimation; electromagnetic simulations; flip-chip interconnects; hermetically encapsulated packages; integrated-circuit chip; multiport packages; nondestructive S-parameter measurement; package characterization; port reduction method; recursive untermination method; silicon process technology; two-port probing techniques; wire bonding; Bonding; Calibration; Diodes; Electronics packaging; Fixtures; Hermetic seals; Impedance; Integrated circuit packaging; Measurement standards; Semiconductor device measurement; Electromagnetic (EM) simulation; flip-chip interconnects; in-situ; nondestructive; package characterization; port reduction method; recursive un-termination; wire bonding;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2005.848103
