Title :
An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes
Author :
Wu, Je-Yi ; Chen, Chih-Ming ; Horng, Ray-Hua ; Wuu, Dong-Sing
Author_Institution :
Dept. of Chem. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
Abstract :
A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently removes the heat generated by the light-emitting diode (LED) chip. Compared with a conventional MCPCB, the MCPCB with a Cu-filled through (blind) hole significantly reduces the peak surface temperature of the LED chip from 46 °C to 39 °C and the total thermal resistance from 8.9 to 2.8 K/W.
Keywords :
cooling; copper; cores; drilling; electroplating; light emitting diodes; printed circuits; Cu; LED chip; MCPCB; chip pad; copper-filled through blind hole; electroplating; heat generation; hole drilling; light-emitting diode chip; metal-core printed circuit board; peak surface temperature reduction; superior heat-dissipation route; temperature 46 degC to 39 degC; thermal resistance; Dielectrics; Heating; Light emitting diodes; Thermal analysis; Thermal conductivity; Thermal resistance; Light-emitting diodes (LEDs); packaging; thermal resistance;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2012.2225404
