• DocumentCode
    847713
  • Title

    Effect of underlayer microstructure on the exchange coupling of Mumetal-Al oxide-Co multilayer

  • Author

    Young-woo Lee ; Lee, T.H. ; Kim, C.G. ; Kim, C.O. ; Yoon, T.S.

  • Author_Institution
    Dept. of Mater. Eng., Chungnam Nat. Univ., Taejon, South Korea
  • Volume
    38
  • Issue
    5
  • fYear
    2002
  • fDate
    9/1/2002 12:00:00 AM
  • Firstpage
    2788
  • Lastpage
    2790
  • Abstract
    Exchange coupling of Mumetal(Ni77Fe14Mo5Cu4 wt%)-Al oxide-Co multilayers has been investigated as a function of Mumetal growth temperature. As Mumetal growth temperature increases from 20°C to 90°C, grain size and surface roughness increase simultaneously. The increase of grain size diminishes the exchange coupling up to 40°C, and increase of roughness increases exchange coupling after 40°C. It is thought that grain size and roughness of the underlayer are competing factors for the interlayer exchange coupling of the magnetic multilayer.
  • Keywords
    aluminium compounds; cobalt; coercive force; copper alloys; exchange interactions (electron); grain size; iron alloys; magnetic hysteresis; magnetic multilayers; magnetic switching; molybdenum alloys; nickel alloys; sputter deposition; surface topography; 20 to 90 degC; Mumetal growth temperature; Mumetal-Al oxide-Co multilayer; Ni77Fe14Mo5Cu4-Al2O3-Co; exchange coupling; grain size; interlayer exchange coupling; magnetic hysteresis loops; magnetic multilayer; rf magnetron sputtering; surface roughness; switching field; underlayer microstructure; Atomic force microscopy; Couplings; Grain size; Magnetic materials; Magnetic multilayers; Magnetic tunneling; Microstructure; Nonhomogeneous media; Scanning electron microscopy; Temperature;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2002.803116
  • Filename
    1042359