• DocumentCode
    848891
  • Title

    Hot-carrier effects in fully depleted submicrometer NMOS/SIMOX as influenced by back interface degradation

  • Author

    Yoshino, Akira ; Ma, T.P. ; Okumura, Koichiro

  • Author_Institution
    Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
  • Volume
    13
  • Issue
    10
  • fYear
    1992
  • Firstpage
    522
  • Lastpage
    524
  • Abstract
    From a systematic study of the hot-carrier-induced degradation in fully depleted submicrometer NMOS/SIMOX as a function of front- and back-gate biases during stress, the authors found that the apparent changes of the front-channel transistor parameters, measured at grounded back gate, could be largely attributed to the virtual back-gate bias effect arising from the trapped charge in the buried oxide. The strong dependence of carrier injection at the back interface on the back-gate bias and its resulting effect on the front-channel transistor parameters are also presented.<>
  • Keywords
    hot carriers; insulated gate field effect transistors; semiconductor-insulator boundaries; NMOSFETs; SIMOX; back interface degradation; back-gate bias; buried oxide; carrier injection; depleted submicrometer NMOS/SIMOX; front gate bias; front-channel transistor parameters; grounded back gate; hot carrier effects; hot-carrier-induced degradation; submicron MOSFETs; systematic study; trapped charge; virtual back-gate bias effect; Boron; Charge measurement; Current measurement; Degradation; Hot carrier effects; Hot carriers; MOS devices; Semiconductor films; Stress measurement; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.192821
  • Filename
    192821