Title :
Series resistance effects in thin oxide capacitor evaluation
Author :
Pio, F. ; Ravazzi, L. ; Riva, C.
Author_Institution :
SGS-Thomson Microelectronics, Agrate Brianza, Italy
Abstract :
The effects of undesired series resistance in thin oxide capacitors are studied. Thin dielectric reliability is usually evaluated by means of accelerated tests (ramped or constant voltage or current stress). It is shown that the breakdown electric field can be highly overestimated due to the series resistance associated with the test structure: the larger the resistance, the bigger the error. Moreover, breakdown detection criteria in automatic test routines become more critical. It is also demonstrated that a nonuniform stress is applied to the dielectric whenever the series resistance is position-dependent, as it usually is. Erroneous breakdown-related defect distributions could be inferred as a consequence of neglecting the series resistance effect. It is therefore suggested that workers pay much attention to the test structure layout definition in order to minimize these problems.<>
Keywords :
MOS integrated circuits; capacitors; dielectric thin films; electric strength; integrated memory circuits; life testing; reliability; MOS memories; accelerated tests; breakdown electric field overestimation; electric strength overestimation; nonuniform stress; series resistance effect; series resistance is position-dependent; test structure layout; thin dielectric reliability evaluation; thin oxide capacitor evaluation; Automatic testing; Breakdown voltage; Capacitors; Dielectric devices; Electric breakdown; Electric resistance; Electrical resistance measurement; Life estimation; Random access memory; Stress;
Journal_Title :
Electron Device Letters, IEEE