DocumentCode
848952
Title
Series resistance effects in thin oxide capacitor evaluation
Author
Pio, F. ; Ravazzi, L. ; Riva, C.
Author_Institution
SGS-Thomson Microelectronics, Agrate Brianza, Italy
Volume
13
Issue
10
fYear
1992
Firstpage
544
Lastpage
546
Abstract
The effects of undesired series resistance in thin oxide capacitors are studied. Thin dielectric reliability is usually evaluated by means of accelerated tests (ramped or constant voltage or current stress). It is shown that the breakdown electric field can be highly overestimated due to the series resistance associated with the test structure: the larger the resistance, the bigger the error. Moreover, breakdown detection criteria in automatic test routines become more critical. It is also demonstrated that a nonuniform stress is applied to the dielectric whenever the series resistance is position-dependent, as it usually is. Erroneous breakdown-related defect distributions could be inferred as a consequence of neglecting the series resistance effect. It is therefore suggested that workers pay much attention to the test structure layout definition in order to minimize these problems.<>
Keywords
MOS integrated circuits; capacitors; dielectric thin films; electric strength; integrated memory circuits; life testing; reliability; MOS memories; accelerated tests; breakdown electric field overestimation; electric strength overestimation; nonuniform stress; series resistance effect; series resistance is position-dependent; test structure layout; thin dielectric reliability evaluation; thin oxide capacitor evaluation; Automatic testing; Breakdown voltage; Capacitors; Dielectric devices; Electric breakdown; Electric resistance; Electrical resistance measurement; Life estimation; Random access memory; Stress;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.192827
Filename
192827
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