DocumentCode :
849376
Title :
Forced Air Cooling of CPUs With Heat Sinks: A Numerical Study
Author :
Ozturk, Emre ; Tari, Ilker
Author_Institution :
Anova CAD-CAE-TEST, ODTU-OSTIM, Ankara
Volume :
31
Issue :
3
fYear :
2008
Firstpage :
650
Lastpage :
660
Abstract :
A common ATX form factor personal computer system is modeled in detail. The flow and temperature fields inside the chassis are numerically investigated as a conjugate heat transfer problem. The computational effort is concentrated on the forced air cooling of the CPU using a heat sink. Three different commercial heat sink designs are analyzed by using commercial computational fluid dynamics software packages Icepak and Fluent. The grid independent, well converged, and well posed simulations are performed, and the results are compared with the experimental data. It is observed that flow obstructions in the chassis and the resulting air recirculation affect the heat sink temperature distribution. The specific thermal resistance values for the heat sinks are compared. It is observed that although they have different geometries, all of the three heat sinks have similar specific thermal resistances. The best heat sink is selected and modified in order to have a lower maximum temperature distribution in the heat sink by changing the geometry and the material. Especially, replacing aluminum with copper as the heat sink material improved the performance. The importance of modeling the entire chassis is demonstrated by comparing the simulation results with the results from a model of only the CPU-heat-sink-fan assembly.
Keywords :
computational fluid dynamics; cooling; heat sinks; microcomputers; software packages; temperature distribution; CPU; Fluent; Icepak; air recirculation; common ATX form factor; computational fluid dynamics; conjugate heat transfer; forced air cooling; heat sink fan assembly; personal computer system; software packages; specific thermal resistance; temperature distribution; Central processing unit (CPU) cooling; computational fluid dynamics; conjugate heat transfer; forced convection; heat sink improvement;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2008.2001840
Filename :
4609939
Link To Document :
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