Title :
A Dielectrically - Isolated Radiation Hardened Technology for LSI
Author :
Sanders, T.J. ; Boarman, J.W. ; Wood, G.M. ; Kasten, A.J.
Author_Institution :
Harris Semiconductor Melbourne, Florida 32901 (305) 724-7547
Keywords :
Apertures; Dielectric thin films; Integrated circuit interconnections; Integrated circuit technology; Isolation technology; Large scale integration; Photoconductivity; Radiation hardening; Resistors; Testing;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.1980.4331094
