• DocumentCode
    85094
  • Title

    Conductive Filament Scaling of {\\rm TaO}_{\\rm x} Bipolar ReRAM for Improving Data Retention Under Low Operation Current

  • Author

    Ninomiya, Tamotsu ; Zhigiang Wei ; Muraoka, S. ; Yasuhara, R. ; Katayama, Kengo ; Takagi, Toshiyuki

  • Author_Institution
    Device Solutions Center, Panasonic Corp., Kyoto, Japan
  • Volume
    60
  • Issue
    4
  • fYear
    2013
  • fDate
    Apr-13
  • Firstpage
    1384
  • Lastpage
    1389
  • Abstract
    The retention model of a bipolar ReRAM considering the percolative paths in a conductive filament is proposed. We demonstrate, for the first time, that the control of oxygen vacancy concentration in a conductive filament is the key for ensuring data retention including tail bits. To improve the retention property under low-current operation, the size of the conductive filament must be scaled down while keeping the density of oxygen vacancy high enough. Based on this concept, we demonstrate both low-current operation and sufficient retention results exceeding 500 h at 150°C, which correspond to more than 10 years at 85°C.
  • Keywords
    bipolar memory circuits; random-access storage; tantalum compounds; TaOx; bipolar ReRAM; conductive filament scaling; data retention; low operation current; oxygen vacancy concentration; percolative path; Arrays; Conductivity; Degradation; Hafnium compounds; Resistance; Semiconductor device modeling; Switches; Conductive filament; hopping-percolation model; resistive switching RAM; retention;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2248157
  • Filename
    6476058