DocumentCode :
85094
Title :
Conductive Filament Scaling of {\\rm TaO}_{\\rm x} Bipolar ReRAM for Improving Data Retention Under Low Operation Current
Author :
Ninomiya, Tamotsu ; Zhigiang Wei ; Muraoka, S. ; Yasuhara, R. ; Katayama, Kengo ; Takagi, Toshiyuki
Author_Institution :
Device Solutions Center, Panasonic Corp., Kyoto, Japan
Volume :
60
Issue :
4
fYear :
2013
fDate :
Apr-13
Firstpage :
1384
Lastpage :
1389
Abstract :
The retention model of a bipolar ReRAM considering the percolative paths in a conductive filament is proposed. We demonstrate, for the first time, that the control of oxygen vacancy concentration in a conductive filament is the key for ensuring data retention including tail bits. To improve the retention property under low-current operation, the size of the conductive filament must be scaled down while keeping the density of oxygen vacancy high enough. Based on this concept, we demonstrate both low-current operation and sufficient retention results exceeding 500 h at 150°C, which correspond to more than 10 years at 85°C.
Keywords :
bipolar memory circuits; random-access storage; tantalum compounds; TaOx; bipolar ReRAM; conductive filament scaling; data retention; low operation current; oxygen vacancy concentration; percolative path; Arrays; Conductivity; Degradation; Hafnium compounds; Resistance; Semiconductor device modeling; Switches; Conductive filament; hopping-percolation model; resistive switching RAM; retention;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2248157
Filename :
6476058
Link To Document :
بازگشت