Title :
Characteristics and applications of a thin-film tapered distributed parameter structure
Author_Institution :
Boeing Co., Seattle, Wash.
fDate :
3/1/1963 12:00:00 AM
Abstract :
Summary form only. An abstract of the above-titled article, taken from the 1963 IEEE International Convention (held March 25-28, New York, NY, USA), is presented.
Keywords :
Admittance; Application software; Computer networks; Dielectric films; Dielectric thin films; Differential equations; Equivalent circuits; Thin film circuits; Transfer functions; Transistors;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/PROC.1963.1985
