• DocumentCode
    852446
  • Title

    Analysis of aging of piezoelectric crystal resonators

  • Author

    Asiz, Andi ; Zhang, Weiping ; Xi, Yunping

  • Author_Institution
    Dept. of Civil, Environ., & Archit. Eng., Colorado Univ., Boulder, CO, USA
  • Volume
    50
  • Issue
    12
  • fYear
    2003
  • Firstpage
    1647
  • Lastpage
    1655
  • Abstract
    Aging of piezoelectric (quartz crystal) resonator has been identified as one of the most important quality control problems of quartz crystal products. Aging is defined as frequency change with time. Aging in quartz resonators can be due to several sources: mass transfer due to contamination inside the resonator enclosure, stress-strain in the resonator blank, quartz defect, etc. In this study, the stress-strain effect, which has been believed as a dominant factor contributing to aging, is studied. The stress-strain effect is caused mainly by the long-term viscoelastic properties of bonding adhesive that attach quartz crystal plate to the ceramic base package. With the available accelerating testing method under elevated temperatures, the stress-strain induced aging in the quartz crystal resonators can be investigated. Because of the miniaturized size of the resonator, a digital image analysis method called image intensity matching technique (IIMT) is applied to obtain deformation patterns in the quartz blank due to thermal load. Our preliminary results showed that the unsymmetric thermal deformations may be a dominant contributing factor to aging. For simulation purposes, finite-element analysis is used to investigate the deformation patterns (i.e., stress-strain distributions) and corresponding natural frequency shift in the piezoelectric resonators. The viscoelastic behavior of mounting adhesives is incorporated into the analysis to show the dominant effect of long-term behavior of stress-strain developed in the crystal resonators. Also, some geometrical aspects-such as uneven mounting supports due to distances, volumes and heights of the adhesives-are simulated in the model.
  • Keywords
    adhesive bonding; ageing; ceramic packaging; crystal resonators; deformation; finite element analysis; image matching; quality control; stress-strain relations; viscoelasticity; aging; bonding adhesive; ceramic base package; deformation patterns; finite element analysis; frequency shift; image intensity matching technique; piezoelectric crystal resonators; quality control; quartz blank; quartz crystal; quartz defect; quartz resonators; stress-strain analysis; testing method; thermal deformations; viscoelastic properties; Aging; Bonding; Ceramics; Contamination; Elasticity; Frequency; Pattern analysis; Quality control; Solid modeling; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2003.1256304
  • Filename
    1256304