DocumentCode :
853561
Title :
Abstracts of forthcoming manuscripts
Volume :
26
Issue :
3
fYear :
2003
fDate :
7/1/2003 12:00:00 AM
Firstpage :
196
Lastpage :
197
Abstract :
Provides an abstract of articles to be presented in a forthcoming issue.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2003.822852
Filename :
1256719
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=853561
