DocumentCode :
853569
Title :
Foreword
Author :
Sung Yi ; Whalley, David C. ; Conway, Paul P.
Author_Institution :
Portland State University
Volume :
26
Issue :
3
fYear :
2003
fDate :
7/1/2003 12:00:00 AM
Firstpage :
198
Lastpage :
199
Keywords :
Automotive engineering; Electronic packaging thermal management; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Integrated circuit reliability; Manufacturing processes; Mechanical engineering; Soldering; Thermal management of electronics;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2003.822298
Filename :
1256720
Link To Document :
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