Author :
Sung Yi ; Whalley, David C. ; Conway, Paul P.
Author_Institution :
Portland State University
fDate :
7/1/2003 12:00:00 AM
Keywords :
Automotive engineering; Electronic packaging thermal management; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Integrated circuit reliability; Manufacturing processes; Mechanical engineering; Soldering; Thermal management of electronics;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2003.822298
