Title :
Out-of-plane high-Q inductors on low-resistance silicon
Author :
Chua, Christopher L. ; Fork, David K. ; Van Schuylenbergh, Koenraad ; Lu, Jeng-Ping
Author_Institution :
Palo Alto Res. Center, CA, USA
Abstract :
Integrated high-Q coils are much sought after because they enable high-quality radio-frequency circuits that do not rely on off-chip discretes. We present a novel surface micro-machined inductor with its coil axis parallel to the substrate plane. Coils fabricated on standard unaltered low-resistance silicon exhibit record-high-quality factors (Q) of over 70 at 1 GHz. The devices are made by three-dimensional (3-D) self-assembly of stress-engineered structures fabricated with standard semiconductor batch processing techniques. We also designed, fabricated, and characterized silicon Bi-CMOS L-C oscillators built around these coils. Compared side by side against state-of-the-art planar spirals, they produce a 12.3 dB lower phase noise at 100 kHz offset, and 14.6 dB after normalizing to frequency and power.
Keywords :
BiCMOS analogue integrated circuits; Q-factor; batch processing (industrial); coils; eddy current losses; microassembling; micromachining; micromechanical devices; self-assembly; semiconductor device packaging; silicon; skin effect; thin film inductors; voltage-controlled oscillators; 1 GHz; BiCMOS L-C oscillators; Si; backend process; die-attached; integrated high-Q coils; integrated inductor; low-resistance silicon; micro-coil; micro-inductor; micromachined springs; open-cavity packages; semiconductor batch processing; skin effect problem; sputter films; stress gradient; stress-engineered structures; surface micromachined inductor; three-dimensional coil; three-dimensional self-assembly; voltage-controlled oscillator; Circuits; Coils; Inductors; Oscillators; Phase noise; Radio frequency; Self-assembly; Silicon; Spirals; Substrates;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2003.820274