DocumentCode
856477
Title
Reliability vs component tolerances in microelectronic circuits
Author
Becker, P.W. ; Warr, R.E.
Author_Institution
General Electric Electronics Laboratory, Syracuse, N. Y.
Volume
51
Issue
9
fYear
1963
Firstpage
1202
Lastpage
1214
Abstract
It is well known that the reliability of a circuit can be increased by designing it for worst-case conditions so that, even if component characteristics drift, the circuit will still operate satisfactorily. However, it is shown in this paper that extreme worst-case design can lead to increased operating temperature and, therefore, again reduced reliability. A method, illustrated by two practical examples, is indicated to find the compromise in component and circuit design tolerances leading to maximum reliability at any specified time or over any specified time interval.
Keywords
Bibliographies; Cleaning; Electronic circuits; Laboratories; Microelectronics; P-n junctions; Semiconductor thin films; Silicon; Temperature; Thin film transistors;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1963.2489
Filename
1444419
Link To Document