• DocumentCode
    856477
  • Title

    Reliability vs component tolerances in microelectronic circuits

  • Author

    Becker, P.W. ; Warr, R.E.

  • Author_Institution
    General Electric Electronics Laboratory, Syracuse, N. Y.
  • Volume
    51
  • Issue
    9
  • fYear
    1963
  • Firstpage
    1202
  • Lastpage
    1214
  • Abstract
    It is well known that the reliability of a circuit can be increased by designing it for worst-case conditions so that, even if component characteristics drift, the circuit will still operate satisfactorily. However, it is shown in this paper that extreme worst-case design can lead to increased operating temperature and, therefore, again reduced reliability. A method, illustrated by two practical examples, is indicated to find the compromise in component and circuit design tolerances leading to maximum reliability at any specified time or over any specified time interval.
  • Keywords
    Bibliographies; Cleaning; Electronic circuits; Laboratories; Microelectronics; P-n junctions; Semiconductor thin films; Silicon; Temperature; Thin film transistors;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1963.2489
  • Filename
    1444419