• DocumentCode
    856606
  • Title

    Electrothermal design aspects of transitioning solid armatures

  • Author

    Schoolderman, A.J. ; de Zeeuw, W.A. ; Koops, M.

  • Author_Institution
    TNO PML-Pulse Phys., Rijswijk, Netherlands
  • Volume
    29
  • Issue
    1
  • fYear
    1993
  • fDate
    1/1/1993 12:00:00 AM
  • Firstpage
    865
  • Lastpage
    870
  • Abstract
    To optimize erosion-free rail accelerator launch of solid brush armatures, a two-dimensional and an analytical model are used to study the temperature distribution, the coefficient of friction, and the transitioning behavior of U-shaped solid armatures made of copper, aluminum, molybdenum, and titanium during electromagnetic launch. In order to verify the insights gained from these theoretical studies experimentally, diagnostic methods are applied. In particular, the growth potential of solid armatures for weapons applications is highlighted by considering such materials as titanium and molybdenum. It is shown that by choosing the appropriate armature material and angle of the trailing edge of the armature, it is possible to delay melting near the rail-armature interface substantially. Molybdenum and titanium U-shaped armatures are shown to be good candidates for achieving arc erosion-free launching at hypervelocities
  • Keywords
    arcs (electric); electromagnetic launchers; melting; temperature distribution; weapons; 2D model; Al armatures; Cu armatures; Mo armatures; Ti armatures; U-shaped solid armatures; analytical model; arc erosion-free launching; diagnostic methods; electromagnetic launch; electrothermal design; erosion-free rail accelerator launch; friction coefficient; hypervelocities; melting; rail-armature interface; solid brush armatures; temperature distribution; trailing edge angle; transitioning behavior; weapons applications; Aluminum; Analytical models; Brushes; Copper; Electrothermal effects; Friction; Rails; Solids; Temperature distribution; Titanium;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.195690
  • Filename
    195690