Title :
SWAN: high-level simulation methodology for digital substrate noise generation
Author :
Badaroglu, Mustafa ; Van der Plas, Geert ; Wambacq, Piet ; Donnay, Stephane ; Gielen, G.E. ; De Man, Hugo J.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
Substrate noise generated by the switching digital circuits degrades the performance of analog circuits embedded on the same substrate. It is therefore important to know the amount of noise at a certain point on the substrate. Existing transistor-level simulation approaches based on a substrate model extracted from layout information are not feasible for digital circuits of practical size. This paper presents a complete high-level methodology, which simulates a large digital standard cell-based design using a network of substrate macromodels, with one macromodel for each standard cell. Such macromodels can be constructed for both EPI-type and bulk-type substrates. Comparison of our substrate waveform analysis (SWAN) to several measurements and to several full SPICE simulations indicates that the substrate noise is simulated with our methodology within 10%-20% error in the time domain and within 2 dB relative error at the major resonance in the frequency domain. However, it is several orders of magnitude faster in CPU time than a full SPICE simulation.
Keywords :
high level synthesis; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; substrates; switching circuits; waveform analysis; EPI-type substrate; SPICE simulations; SWAN; analog circuits; bulk-type substrates; digital standard cell; digital substrate noise generation; frequency domain; ground bounce; high-level simulation; mixed analog-digital IC; substrate macromodels; substrate waveform analysis; switching digital circuits; time domain; Analog circuits; Analytical models; Circuit noise; Circuit simulation; Data mining; Degradation; Digital circuits; Noise generators; SPICE; Switching circuits; High-level simulation; ground bounce; macromodel; mixed analog–digital ICs; substrate noise;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2005.863191