DocumentCode :
857311
Title :
A 1680-V (at 1 \\hbox {mA/cm}^{2} ) 54-A (at 780 \\hbox {W/cm}^{2} ) Normally ON 4H-SiC JFET
Author :
Veliadis, V. ; McNutt, T. ; Snook, M. ; Hearne, H. ; Potyraj, P. ; Scozzie, C.
Author_Institution :
Adv. Technol. Lab., Northrop Grumman Electron. Syst., Linthicum, MD
Volume :
29
Issue :
10
fYear :
2008
Firstpage :
1132
Lastpage :
1134
Abstract :
A high-voltage normally ON 4H-SiC vertical junction field-effect transistor (VJFET) of 0.143- cm2 active area was manufactured in seven photolithographic levels with no epitaxial regrowth and with a single masked ion-implantation event. The VJFET exhibits low gate-to-source p-n-junction leakage current with relatively sharp onset of breakdown. At a drain-current density of 1 mA/cm2, the VJFET blocks 1680 V at a gate bias of -24 V. A self-aligned floating guard-ring structure provides edge termination that blocks 77% of the 11.8-mum SiC drift layer´s limit. At a gate bias of 2.5 V and a corresponding gate current of 2 mA, the VJFET outputs 53.6 A (375 A/cm2) at a forward drain voltage drop of 2.08 V (780 W/cm2). The transistor current gain is ID / IG = 26 800, and the specific on-state resistance is 5.5 mOmegamiddotcm2. To our best knowledge, this is the largest area SiC vertical-channel JFET reported to date and outputs more drain current than any 1200-V class vertical-channel JFET under identical heat-load and gate biasing conditions.
Keywords :
ion implantation; junction gate field effect transistors; leakage currents; ON-state resistance; SiC; current 2 mA; gate-to-source p-n-junction leakage current; single masked ion implantation; vertical junction field-effect transistor; voltage -24 V; voltage 1680 V; voltage 2.5 V; 4H-SiC; High current; JFET; high power; high voltage; large area; normally ON; vertical channel;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.2002907
Filename :
4623142
Link To Document :
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