DocumentCode :
85761
Title :
A 5.9-GHz Fully Integrated GaN Frontend Design With Physics-Based RF Compact Model
Author :
Pilsoon Choi ; Goswami, Sushmit ; Radhakrishna, Ujwal ; Khanna, Devrishi ; Chirn-Chye Boon ; Hae-Seung Lee ; Antoniadis, Dimitri ; Li-Shiuan Peh
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol. (MIT), Cambridge, MA, USA
Volume :
63
Issue :
4
fYear :
2015
fDate :
Apr-15
Firstpage :
1163
Lastpage :
1173
Abstract :
This paper presents the design of a fully integrated high-efficiency and high-power RF frontend for the IEEE 802.11p standard in GaN HEMT technology. An embedded transmitter/receiver (Tx/Rx) switching scheme and a dual-bias power amplifier linearization technique are used to improve Tx efficiency and linearity. An accurate physics-based nonlinear large-signal device model is developed and used for the design, providing insight into the impact of the behavioral nuances of the GaN HEMTs on RF circuit performance. The fully integrated RF frontend is fabricated in 0.25- μm GaN-on-SiC technology and occupies only 2 mm × 1.2 mm. The Tx branch achieves 48.5% drain efficiency at 33.9 dBm, Psat with 28-V supply. With orthogonal frequency-division multiplexing modulated signals, it achieves 30% average efficiency at 27.8-dBm output power while meeting the -25-dB error vector magnitude limit without predistortion. The Rx branch achieves +22-dBm output third-order intercept point with 3.7-dB noise figure at 12-V supply. The fully integrated high-efficiency and linear RF frontend designed with physics-based RF GaN compact models is demonstrated for the first time for future device-to-device applications.
Keywords :
III-V semiconductors; field effect MMIC; gallium compounds; high electron mobility transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; GaN HEMT technology; GaN-SiC; IEEE 802.11p standard; RF circuit GaN-on-SiC technology; dual-bias power amplifier linearization technique; embedded transmitter/receiver switching scheme; frequency 5.9 GHz; fully integrated GaN frontend design; orthogonal frequency-division multiplexing modulated signals; physics-based RF compact model; size 0.25 mum; voltage 12 V; Antennas; Gallium nitride; HEMTs; Integrated circuit modeling; Power generation; Radio frequency; Switches; Antenna switch; GaN HEMT; IEEE 802.11p; RF frontend; compact model; device-to-device (D2D) communication; drain efficiency; low-noise amplifier (LNA); power amplifier (PA);
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2015.2405913
Filename :
7053960
Link To Document :
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