Abstract :
In this paper, the 3D-IC Alliance, a consortium of integrated-circuit designers, developers, and manufacturers that promotes 3D-chip standards to accelerate their adoption, has released its intimate memory interconnect standard (IMIS) for vertical processors.
Keywords :
electronics industry; integrated circuit interconnections; memory architecture; standards; 3D-IC Alliance; 3D-chip standard; integrated-circuit designers; intimate memory interconnect standard; vertical processors; Cooling; Displays; Energy efficiency; Laboratories; Logic; Standards publication; Supercomputers; Switches; Three-dimensional integrated circuits; User interfaces; 3D chips; 3D-IC Alliance; Celemony Software; Direct Note Access; Intimate Memory Interconnect Standard; Register.com; energy-efficiency; music editing; supercomputers;
