DocumentCode
858008
Title
News Briefs
Author
Paulson, Linda Dailey
Volume
41
Issue
9
fYear
2008
Firstpage
18
Lastpage
20
Abstract
In this paper, the 3D-IC Alliance, a consortium of integrated-circuit designers, developers, and manufacturers that promotes 3D-chip standards to accelerate their adoption, has released its intimate memory interconnect standard (IMIS) for vertical processors.
Keywords
electronics industry; integrated circuit interconnections; memory architecture; standards; 3D-IC Alliance; 3D-chip standard; integrated-circuit designers; intimate memory interconnect standard; vertical processors; Cooling; Displays; Energy efficiency; Laboratories; Logic; Standards publication; Supercomputers; Switches; Three-dimensional integrated circuits; User interfaces; 3D chips; 3D-IC Alliance; Celemony Software; Direct Note Access; Intimate Memory Interconnect Standard; Register.com; energy-efficiency; music editing; supercomputers;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/MC.2008.395
Filename
4623216
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