Title :
Single-wire GaAs IC communication technique
Author :
Reekie, H.M. ; Lam, S.C.K. ; Flynn, B.W.
Author_Institution :
Dept. of Electr. Eng., Edinburgh Univ., UK
Abstract :
A novel method of single-wire chip-to-chip communication designed for DCFL-based GaAs ICs using a three-level signal is described. Significant reductions in I/O port area and power consumption, and guaranteed data-framing synchronisation are the main advantages over previous two-wire systems. Circuit diagrams and modified-SPICE simulations are presented.
Keywords :
III-V semiconductors; digital integrated circuits; field effect integrated circuits; gallium arsenide; integrated circuit technology; DCFL-based GaAs ICs; GaAs; advantages; bit serial communications; chip to chip connections; circuit diagrams; guaranteed data-framing synchronisation; modified-SPICE simulations; power consumption reduction; reductions in I/O port area; semiconductors; single-wire chip-to-chip communication; three-level signal;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19890036
