Title :
Self-Shielded Circularly Polarized Antenna-in-Package Based on Quarter Mode Substrate Integrated Waveguide Subarray
Author :
Cheng Jin ; Rui Li ; Sanming Hu ; Songbai Zhang ; Ka Fai Chang ; Boyu Zheng
Author_Institution :
Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
Abstract :
A self-shielded antenna-in-package (AiP) covering IEEE 802.11a band is proposed in this paper, and the antenna is designed using quarter mode substrate integrated waveguide (QMSIW) subarray technology. Electromagnetic interference (EMI) in a system-in-package integrated with AiP is discussed firstly. Electric field distribution of the proposed AiP is simulated, and it shows that the metallic via-holes array in the QMSIW subarray approximates to the electric wall to isolate the electromagnetic field coupling and then to increase the EMI shielding. The operating principle of the proposed antenna is investigated through an isosceles right triangular waveguide. An antenna prototype is fabricated and measured. The measured results match with the simulated and analyzed results very well. It is demonstrated that the proposed QMSIW subarray with metallic via-holes array gives an attractive and promising way to design the AiP with self-shielded property.
Keywords :
electromagnetic coupling; electromagnetic interference; electromagnetic shielding; substrate integrated waveguides; system-in-package; waveguide antenna arrays; AiP; EMI shielding; IEEE 802.11a band; QMSIW subarray technology; electric field distribution; electromagnetic field coupling; electromagnetic interference; isosceles right triangular waveguide; metallic via-holes array; quarter mode substrate integrated waveguide subarray; self-shielded circularly polarized antenna-in-package; system-in-package; Antenna arrays; Arrays; Electromagnetic interference; Electromagnetic waveguides; Electromagnetics; Substrates; Antenna-in-package (AiP); circularly polarized (CP); half-mode/quarter-mode substrate integrated waveguide; self-shielded; system-in-package (SiP);
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2300508