Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate

Author

Baranski, Marcin ; Bargiel, Sylwester ; Passilly, Nicolas ; Guichardaz, B. ; Herth, E. ; Gorecki, Christophe ; Chenping Jia ; Fromel, J. ; Wiemer, M.

Author_Institution

Micro Nano Sci. & Syst. Dept., FEMTO-ST Inst., Besançon, France

Volume

26

Issue

1

fYear

2014

fDate

Jan.1, 2014

Firstpage

100

Lastpage

103

Abstract

This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45 ^° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of wafer-level alignment/assembly, suitable for vertically integrated imaging micro-instruments. The device, including additional out-of plane reflection for extraction of sensing beam, can be as small as 1 mm³.

Keywords

integrated optics; micro-optics; optical arrays; optical beam splitters; optical fabrication; optical glass; glass substrate saw-dicing; integrated imaging microinstruments; integrated microoptical beam splitter; microcube-typed beam-splitter; opitcal array; wafer-level alignment; wafer-level assembly; wafer-level fabrication; Blades; Glass; Laser beams; Optical device fabrication; Substrates; Surface treatment; Optical beam splitting; optical components; optical devices fabrication;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2013.2289981

Filename

6657824