DocumentCode :
862935
Title :
High-temperature ampacity model for overhead conductors
Author :
Chen, Shelley L. ; Black, W.Z. ; Loard, H.W., Jr.
Author_Institution :
Cordis Corp., Miami Lakes, FL, USA
Volume :
17
Issue :
4
fYear :
2002
fDate :
10/1/2002 12:00:00 AM
Firstpage :
1136
Lastpage :
1141
Abstract :
A computer-based ampacity model that can predict the temperature of overhead conductors for temperatures as high as 250°C has been developed. The model is a revision of a program that has been reliably used for approximately 20 years to calculate the transient ampacity of a wide variety of conductor designs. The accuracy of the program has been determined by comparing the program predictions with temperatures that are measured on a full-scale energized outdoor test span. The accuracy of the program decreases as the average conductor temperature increases. As the conductor temperature increases, the spatial variations, both azimuthal and radial, are magnified and the task of calculating a single, average conductor temperature becomes more challenging. Typical variations in the conductor temperature were as high as 65°C in a single span when the conductor temperature approached 250°C. These temperature variations create difficulties when trying to either measure the conductor temperature with hardware attached to the line or predict the temperature with a computer-based ampacity model.
Keywords :
overhead line conductors; power overhead lines; temperature distribution; thermal analysis; transmission line theory; transmission network calculations; 250 C; 65 C; average conductor temperature; computer simulation; heat transfer; high-temperature ampacity model; power overhead conductors; temperature prediction model; transient ampacity; Conductors; Energy measurement; Hardware; Heat transfer; Land surface temperature; Power industry; Power system modeling; Predictive models; Temperature measurement; Testing;
fLanguage :
English
Journal_Title :
Power Delivery, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8977
Type :
jour
DOI :
10.1109/TPWRD.2002.804003
Filename :
1046895
Link To Document :
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