• DocumentCode
    86332
  • Title

    Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs

  • Author

    Yamin Zhang ; Shiwei Feng ; Hui Zhu ; Chunsheng Guo ; Bing Deng ; Guangchen Zhang

  • Author_Institution
    Lab. of Semicond. Device Reliability Phys., Beijing Univ. of Technol., Beijing, China
  • Volume
    35
  • Issue
    3
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    345
  • Lastpage
    347
  • Abstract
    The self-heating effect on the drain current transient response in AlGaN/GaN high electron mobility transistors (HEMTs) was investigated experimentally. Two steps were observed as the drain current dropped with time. The relationship between the transient temperature rise in the channel and the drop in the drain current are discussed in detail. The decrease in the transient drain current and the rise in the channel transient temperature had a complementary relationship. The decrease in the channel electron mobility, caused by self-heating, was an important factor in the drain current drop in the AlGaN/GaN HEMTs.
  • Keywords
    III-V semiconductors; aluminium compounds; electric current; electron mobility; gallium compounds; high electron mobility transistors; transient response; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN high electron mobility transistors; HEMT; channel electron mobility; drain current drop; drain current transient response; self-heating effect; transient drain current; transient temperature rise; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Temperature measurement; Thermal resistance; Transient analysis; AlGaN/GaN HEMTs; drain current transient response; self-heating; transient temperature rise;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2300856
  • Filename
    6730690