DocumentCode
86332
Title
Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs
Author
Yamin Zhang ; Shiwei Feng ; Hui Zhu ; Chunsheng Guo ; Bing Deng ; Guangchen Zhang
Author_Institution
Lab. of Semicond. Device Reliability Phys., Beijing Univ. of Technol., Beijing, China
Volume
35
Issue
3
fYear
2014
fDate
Mar-14
Firstpage
345
Lastpage
347
Abstract
The self-heating effect on the drain current transient response in AlGaN/GaN high electron mobility transistors (HEMTs) was investigated experimentally. Two steps were observed as the drain current dropped with time. The relationship between the transient temperature rise in the channel and the drop in the drain current are discussed in detail. The decrease in the transient drain current and the rise in the channel transient temperature had a complementary relationship. The decrease in the channel electron mobility, caused by self-heating, was an important factor in the drain current drop in the AlGaN/GaN HEMTs.
Keywords
III-V semiconductors; aluminium compounds; electric current; electron mobility; gallium compounds; high electron mobility transistors; transient response; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN high electron mobility transistors; HEMT; channel electron mobility; drain current drop; drain current transient response; self-heating effect; transient drain current; transient temperature rise; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Temperature measurement; Thermal resistance; Transient analysis; AlGaN/GaN HEMTs; drain current transient response; self-heating; transient temperature rise;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2300856
Filename
6730690
Link To Document