DocumentCode :
86332
Title :
Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs
Author :
Yamin Zhang ; Shiwei Feng ; Hui Zhu ; Chunsheng Guo ; Bing Deng ; Guangchen Zhang
Author_Institution :
Lab. of Semicond. Device Reliability Phys., Beijing Univ. of Technol., Beijing, China
Volume :
35
Issue :
3
fYear :
2014
fDate :
Mar-14
Firstpage :
345
Lastpage :
347
Abstract :
The self-heating effect on the drain current transient response in AlGaN/GaN high electron mobility transistors (HEMTs) was investigated experimentally. Two steps were observed as the drain current dropped with time. The relationship between the transient temperature rise in the channel and the drop in the drain current are discussed in detail. The decrease in the transient drain current and the rise in the channel transient temperature had a complementary relationship. The decrease in the channel electron mobility, caused by self-heating, was an important factor in the drain current drop in the AlGaN/GaN HEMTs.
Keywords :
III-V semiconductors; aluminium compounds; electric current; electron mobility; gallium compounds; high electron mobility transistors; transient response; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN high electron mobility transistors; HEMT; channel electron mobility; drain current drop; drain current transient response; self-heating effect; transient drain current; transient temperature rise; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Temperature measurement; Thermal resistance; Transient analysis; AlGaN/GaN HEMTs; drain current transient response; self-heating; transient temperature rise;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2300856
Filename :
6730690
Link To Document :
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