Title :
Electrical and physical properties of ultrathin reoxidized nitrided oxides prepared by rapid thermal processing
Author :
Hori, Takashi ; Iwasaki, Hiroshi ; Tsuji, Kazuhiko
Author_Institution :
Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
fDate :
2/1/1989 12:00:00 AM
Abstract :
A systematic study of the correlations between electrical and physical properties of nanometer-range reoxidized nitrided oxide films is reported. Rapid thermal processing was applied to the full fabrication process 7.7-nm-thick oxides nitrided at various conditions were reoxidized at 900-1150°C for 15-600 s. Nitridation- and reoxidation-condition dependences of charge-trapping properties, i.e. the flat-band voltage shift and the increase of midgap interface state density induced by a high-field stress, were studied. The hydrogen concentration in the film and the nitrogen concentration near the Si-SiO 2 interface were measured by secondary ion mass-spectroscopy and Auger electron spectroscopy respectively. It was shown that striking improvement of the charge-trapping properties by rapid reoxidation is achieved by the reducing of hydrogen concentration while keeping the nitrogen concentration near the interface unchanged
Keywords :
VLSI; field effect integrated circuits; integrated circuit technology; oxidation; semiconductor technology; 15 to 600 s; 7.7 nm; 900 to 1150 C; Auger electron spectroscopy; H concentration; N concentration; ONO; ONO films; RTP; Si-SiO2 interface; ULSI technology; charge-trapping properties; electrical properties; fabrication process; flat-band voltage shift; high-field stress; increase of midgap interface state density; nanometer-range reoxidized nitrided oxide films; nitridation condition dependences; physical properties; rapid reoxidation; rapid thermal processing; reoxidation-condition dependences; secondary ion mass-spectroscopy; ultrathin reoxidized nitrided oxides; Electron traps; Hydrogen; Interface states; MOS devices; Mass spectroscopy; Nitrogen; Rapid thermal processing; Temperature; Thermal resistance; Thermal stresses;
Journal_Title :
Electron Devices, IEEE Transactions on