Multi-chip packaging for high speed superconducting circuits

Author

Sandell, R.D. ; Akerling, G. ; Smith, A.D.

Author_Institution

Space & Electron. Group, TRW Inc., Redondo Beach, CA, USA

Volume

5

Issue

2

fYear

1995

fDate

6/1/1995 12:00:00 AM

Firstpage

3160

Lastpage

3163

Abstract

We report the development of a multi-chip module (MCM) technology using Nb metallization and benzocyclobutene (BCB) polymer dielectric. The Nb/BCB structure displays very low loss, has low processing temperature, and forms a wide range of microstrip transmission line impedances. We are developing flip chip, solder attachment for die mounting. We also report the electrical characterization of Nb/BCB/Nb for both microstrip resonators, delay lines, and bandpass filters.<>

Keywords

flip-chip devices; integrated circuit packaging; microstrip circuits; multichip modules; superconducting integrated circuits; Nb; Nb metallization; Nb/BCB/Nb structure; bandpass filters; benzocyclobutene polymer dielectric; delay lines; die mounting; electrical characterization; flip chip; high speed superconducting circuits; loss; microstrip resonators; microstrip transmission line impedance; multi-chip module; packaging; processing temperature; solder attachment; Circuits; Dielectrics; Displays; Metallization; Niobium; Packaging; Polymers; Propagation losses; Superconducting transmission lines; Temperature distribution;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.403262

Filename

403262