DocumentCode :
864016
Title :
DNA-templated copper nanowire fabrication by a two-step process involving electroless metallization
Author :
Kudo, Hidetoshi ; Fujihira, Masamichi
Author_Institution :
Dept. of Biomolecular Eng., Tokyo Inst. of Technol., Yokohama
Volume :
5
Issue :
2
fYear :
2006
fDate :
3/1/2006 12:00:00 AM
Firstpage :
90
Lastpage :
92
Abstract :
Here, we report a new fabrication method of DNA-templated copper nanowires. The copper nanowires were fabricated via two-step reactions. First, Pd(II) ions were electrostatically adsorbed onto negatively charged DNA molecules immobilized on the substrate surfaces and reduced chemically. As a result, palladium nanowires with a diameter of approximately 6 nm were obtained. Second, the palladium nanowires were dipped into a copper electroless plating bath. Electroless deposition of copper proceeded specifically on the palladium nanowires. The diameters of the copper nanowires were controlled by the plating time
Keywords :
DNA; adsorption; copper; electroless deposition; metallisation; molecular biophysics; nanotechnology; nanowires; palladium; Cu; DNA-templated copper nanowire fabrication; Pd; copper electroless plating bath; electroless deposition; electroless metallization; electrostatic adsorption; nanotechnology; palladium ions; palladium nanowires; substrate surfaces; two-step reaction; Chemicals; Copper; DNA; Fabrication; Glass; Lithography; Metallization; Nanotechnology; Palladium; Tellurium; Copper; DNA; nanotechnology; palladium;
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2006.869691
Filename :
1605219
Link To Document :
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